Our low-profile connectors are a compact and lightweight solution for applications where weight, space, and/or EMI shielding are critical. By utilizing plated composite thermoplastic materials, they offer approximately 15-20% weight savings.
Comparable in size but higher in density than D-subminature configurations, these connectors are:
- A field-repairable option for pre-wired connectors of similar size & density
- Ideal for use in applications for signal, USB, Ethernet, and audio connections
- Available in customizable materials (i.e., aluminum, steel, and composite)
- Available with 50, 15, 26, and 44 positions
| Features | Benefits |
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Utilizes standard MIL-C-39029 contacts | - Faster and more economical solution compared to custom contacts
- Standard crimp, insertion, and removal tools can be used, which can drive cost savings
- Reduced lead time since contacts are readily available off-the-shelf from various sources
- Crimp Contacts Allow for field repair/installation, saving time and money
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Compact and lightweight | - Up to 60% higher contact density than a D-Sub connectors with a similar footprint
- 30% smaller in width and height than standard D-Sub connector/ backshell assemblies
- 30% lighter than standard D-Sub connector/backshell assemblies
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| High density design | - Field repairable, replaceable insert, and contact technology vs a pre-wired, potted, non-repairable assembly system as found in Micro D-Subminiature connectors
- Results in a better-performing contact that carries more current and voltage per contact line on a similar footprint and pin count as a Micro D-Subminiature connector
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| Excellent shell-to-shell conductivity | - Better-performing grounding path than standard D-Sub/Micro-D connectors
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| High-temperature capable (up to 175°C) | - Compliant with aerospace flammability and toxicity requirements
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