Blog

Space efficiency is now a core requirement in modern RF PCB design as systems become smaller and more complex. High‑frequency platforms—like phased arrays, MIMO systems, and compact radar modules—need more channels, stronger isolation, and lower loss, all within limited board space. Efficient layouts help minimize routing length, preserve signal integrity, maintain grounding and shielding effectiveness, and reduce mechanical stress in dense assemblies. This blog explains why space optimization is essential for high‑density RF designs and how CDI’s CoreHC™ Ganged RF Interconnects provide a compact, high‑performance solution that supports shorter routing, improved isolation, and reliable mechanical integration.

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