Board-to-Board Solutions

Amphenol CDI’s Compliant Interposer revolutionizes high‑speed interconnect performance for Test, Space, and Military applications, delivering exceptional signal integrity and versatility for next‑generation electronic systems. Designed for both 5G optical and copper subsystems, it features a solderless compression‑mount architecture that ensures flexible integration, minimal insertion loss, and ultra‑low crosstalk—supporting data rates up to 130 Gbps with outstanding consistency and reliability.

As a low‑profile board‑to‑board connector with a compact 2.5 mm pitch, the Compliant Interposer enables dense PCB layouts and eliminates the complexity of traditional multi‑piece soldered assemblies. A single part supports single‑ended or differential signaling, as well as CPW or strip‑line designs, offering a true “one‑solution” approach for advanced RF and digital systems. Delivering performance beyond 40 GHz without the variability of soldered connections, it sets a new benchmark for high‑speed performance, reliability, and ease of integration in demanding mission‑critical environments.