Amphenol CDI’s Hermetic Interposer delivers reliable RF signal feedthrough for quantum computing, cryogenic, and high‑vacuum applications, featuring a robust hermetic seal, airtight integrity, high‑density CoreHC™/ Core Cryo interconnect technology, and repeatable, solderless, compact integration—making it the ideal solution for next‑generation systems requiring superior signal integrity and ultra‑low‑leak performance.
